Enterasys Security Router X-PeditionTM Manual de usuario Pagina 4

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Advanced routing
automation allows
rapid routing of
escape patterns from
dense, high-pin-count
devices. Complex
breakouts from dense
packages can be
automatically
optimized
spontaneously, all with
the look and feel of
hand routing.
Rules by Area
Rules by Area allows a designer to take into account high
areas of density limiting the impact to overall design
manufacturability, yield and cost. Rule areas represent
complete physical rule sets that are obeyed by online and
batch design rule checking (DRC) and in interactive and
automatic routing. Trace widths, via sizes and spans, and
clearances dynamically change when traversing into or
out of the rule area.
Dynamic Area Fill
Dynamic Area Fill allows a designer to see the actual plane
metal as it will be manufactured during the entire design
process. This allows visualization of the
placement and routing effects on the plane
metal to ensure design changes meet your
electrical requirements. Complex area fill
strategies can be created based on thermal or
connectivity requirements, for example on high
pin count devices. Area fills automatically heal
around traces, vias, pads and other fills as the
board is edited. Moving a via pushes and shoves
other vias, traces, and area fills and connectivity
is automatically maintained. Advanced z-axis
constraints also dynamically clear area fills on
adjacent layers, when required.
3D Layout
One of the challenges to integrating your PCB
design process into the electromechanical world
is the ability to left-shift validation into the PCB
layout processes to find electromechanical design
problems early, eliminating costly re-design late in the
cycle. 3D layout is a fully integrated 2D/3D environment
and uses the same selection, planning and placement
functionality as the PCB layout tool. The true parametric
3D mechanical kernel uses a complete set of 3D
constraints with dynamic collision detection and batch
verification to ensure your electromechanical
designs are error free. Full photo-realistic
visualization of board elements, like traces,
components, silk screen, solder mask, and vias, is
provided with transparency, z-axis scaling, view/
rotation control, and x/y/z cut planes.
Included with 3D layout is ~4.5 million-part 3D
model library. The ability to import your own
models or even create your own models from
parametric component templates is also
available. Models are easily mapped and aligned
with included library tools. You can also import
mechanical components like chassis and heat sinks, and
even sub-assemblies of other PCB designs, providing true
mechanical multi-board capability.
Once your design is complete, you can use the integrated
MCAD Collaboration tool to pass information to popular
industry mechanical design systems. You can also export
your design in standard industry formats, and utilize the
3D PDF and documentation tools to complete your design
package.
Xpedition 3D layout is key element in your design toolkit
to be first to market with today’s advanced electromech
anical designs.
Design Reuse
Design reuse automates the process of copying circuits to
reduce the overall PCB design cycle time while improving
quality by using known good IP. Integrated copy-circuit
functionality allows circuits to be copied and pasted
within and between designs with advanced equivalency
algorithms to automatically map the schematic logic to
the circuit during the copy process. In addition, the use of
3D visualization, placement and validation optimizes PCB electromechanical design.
PCB layout provides advanced tools for build-up and
microvia structures.
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