Enterasys Security Router X-PeditionTM Manual de usuario descargar pdf (Pagina 6)

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synchronized. Automated and customizable creation and

distribution of manufacturing data results in increased

quality, accuracy and design throughput. Data can be

output to manufacturing using the ODB++ format,

ensuring that all manufacturing data is included and

synchronized, and the design intent is maintained.

Additional CAM formats and reporting, including Gerber,

NC drill, and pick and place, are also supported.

Advanced and Emerging PCB Technologies

RF Circuit Design

RF circuits can be designed directly into your PCB layout

or you can transfer designs from Agilent and AWR tools

using the dynamic link, eliminating error prone translation

processes. PCB layout understands the RF circuitry, and is

not simply translating the design. Schematic entry and RF

circuit layout can be started in one

environment and continued in the other; the

dynamic link gives maximum flexibility. The

simulation, tuning, and optimization

capabilities of the RF simulation environment

are supplied by the RF simulator. The dynamic

link transfers the complete RF circuit intent to

the RF simulator. This is done by transferring

only what the RF simulator needs for a

successful simulation, not the entire circuit.

Embedded Passive/Active Design

Xpedition has automated creating layouts with

embedded passive/actives that used to take

weeks of manual effort. As ICs and FPGAs

increase in speed and density, they require

more passive components (resistors and capacitors) —

some may need several hundred. Implementing these as

embedded components versus discrete SMDs can

significantly reduce board sizes and improve performance.

A complete embedded solution is provided: trade-off

tools decide which components can be implemented as

embedded versus discrete based on board size and cost,

passive material choices, automatic synthesis driven by

material supplier’s libraries, and full manufacturing data

generation. Embedded active components can also be

utilized in your most advanced designs.

Automation

Automation provides customization capability to

automate specific and unique design processes for greater

efficiency. Extensibility within the design and layout

products, allows creation of custom functionality,

automation of repetitive tasks, and the ability to tailor the

flow to customer-specific use cases. The use of a wide

range of industry standard languages (VBscript, Jscript,

TCL, Java, VB6, C++, C#, VB.NET...) minimizes start-uptime

for company programmers and facilitates script reuse. As a

result, automation reduce errors, increases productivity,

increases the performance, quality, and reliability of the

design, decreases the cost of the design, and decreases

time to market (and time to profit).

Advanced Packaging

Typically, die level packaging design is done in a separate

tool, but with Xpedition, embedding die level packaging

into your layout using wire bonding technology is

available within the same integrated database. Advanced

constraint definitions for cavity design, chip-on-board, and

multi- and stacked-dies are maintained in the integrated

constraint manager. Ease-of-use wizards are provided to

create advanced die bond patterns, and wire bonds can

be validated for DRC errors using 3D visualization.

With the RF design tool, RF shapes are defined and placed from the

schematic, and meanders can be added at any time.

3D visualization with DRC validation of wire bond and cavity designs improves the

quality in advanced packaging applications.

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